Effect of Nano-TiO2 Addition on Wettability and Interfacial Reactions of Sn0.7Cu Composite Solder/Cu Solder Joints

in English journal, 英文期刊
標題Effect of Nano-TiO2 Addition on Wettability and Interfacial Reactions of Sn0.7Cu Composite Solder/Cu Solder Joints
出版類型英文期刊(EI)
出版年度2010
AuthorsLung-Chuan Tsao(L. C.Tsao), 曹龍泉, B. C. Wang B. C. W., C. W. Chang C. W. C., & M. W. Wu M. W. W.
開始頁250
頁數3
出版日期2010 / 8
其他編號0000
期刊名稱2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
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