Growth kinetics of the intermetallic compounds during the interfacial reactions between Sn3.5Ag0.9Cu-nanoTiO2 alloys and Cu substrate

in Sciences Citation Index(SCI), 科學引文索引資料庫(SCI)
標題Growth kinetics of the intermetallic compounds during the interfacial reactions between Sn3.5Ag0.9Cu-nanoTiO2 alloys and Cu substrate
出版類型SCI(Sciences Citation Index)
出版年度2010
AuthorsLung-Chuan Tsao(L. C.Tsao), 曹龍泉, T. T. Lo T. T. L., & S. F. Peng S. F. P.
開始頁190
頁數4
出版日期2012 / 1
其他編號0000
期刊名稱2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
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