An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu–XTiO2 composite solders as functions of alloy composition and cooling rate

in Sciences Citation Index(SCI), 科學引文索引資料庫(SCI)
標題An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu–XTiO2 composite solders as functions of alloy composition and cooling rate
出版類型SCI(Sciences Citation Index)
出版年度2011
AuthorsLung-Chuan Tsao(L. C.Tsao), 曹龍泉
開始頁41
頁數7
出版日期2011 / 11
其他編號0000
中文摘要

In the present study, the influence of both TiO2 nanoparticle addition and cooling rate on the melting temperature,
microstructure, and mechanical behaviour of Sn3.5Ag0.5Cu (SAC) solder alloys was studied. The
composite solders were prepared by mechanical mixing of TiO2 nanoparticles with SAC solder. With the
addition of TiO2 nanoparticles into the eutectic SAC alloy, a novel SAC composite solder was successfully
prepared. The melting temperature for the SAC composite solders was found to be only 1.56 ?C higher
than that of the SAC solder, indicating that the novel SAC composite solder is fit for existing soldering
process. The cooling rate and TiO2 nanoparticle addition affected the solidification of the microstructure
dramatically. Notably, SEM observation of the microstructure of the SAC composite solders under the
rapid-cooled condition revealed fine dot-like nano-Ag3Sn IMC in the solder matrix. The ultimate tensile
strength (UTS), 0.2% yield strength (0.2YS), and microhardness of the SAC composite solder increased
with the increase of TiO2 nanoparticle content by 0.25–1.0 wt.% and the cooling rate, which could be
attributed to the dispersion strengthening mechanisms. However, the ductility of the composite solders
was found to decrease because of microporosity at the Ag3Sn network grain boundary.

期刊名稱Materials Science and Engineering A
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