The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction

in Sciences Citation Index(SCI), 科學引文索引資料庫(SCI)
標題The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction
出版類型SCI(Sciences Citation Index)
出版年度2011
AuthorsS. Y. Chang, S. Y. C., Lung-Chuan Tsao(L. C.Tsao) 曹龍泉, M. W. Wu M. W. W., & C. W. Chen C. W. C.
開始頁100
頁數7
出版日期2012 / 1
其他編號0000
期刊名稱J Mater Sci: Mater Electron
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