Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

in Sciences Citation Index(SCI), 科學引文索引資料庫(SCI)
標題Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging
出版類型SCI(Sciences Citation Index)
出版年度2011
AuthorsLung-Chuan Tsao(L. C.Tsao), 曹龍泉
開始頁8441
頁數7
出版日期2011 / 8
其他編號0000
期刊名稱Journal of Alloys and Compounds
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