Suppressing effect of 1 wt. % nano-Ti02 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

in English journal, 英文期刊
標題Suppressing effect of 1 wt. % nano-Ti02 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging
出版類型英文期刊(EI)
出版年度2012
AuthorsLung-Chuan Tsao(L. C.Tsao), 曹龍泉, & HUANG WEI TAI 黃惟泰
開始頁465
頁數3
出版日期2013 / 3
其他編號0000
期刊名稱International Conference on Electronic Packaging Technology & High Density Packaging
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